Liquid-cooling type thermal module

ABSTRACT

A liquid-cooling type thermal module includes a liquid cooling unit and at least one heat pipe. The heat pipe has a heat-absorbing end and a heat-dissipating end. The heat-absorbing end is connected to at least one heat-producing element. The heat-producing element is located inside a system while the liquid cooling unit is located outside the system. The heat pipe connects the heat-producing element to the liquid cooling unit. Heat produced by the heat-producing element is absorbed by the heat-absorbing end and transferred to the remote liquid cooling unit via the heat-dissipating end to be dissipated. With the heat pipe being used as a medium for conducting heat, the problem of fluid leak can be eliminated, and the heat produced by the heat-producing element can be effectively carried away from the system without stagnating around the heat-producing element, enabling the thermal module to provide excellent heat dissipating effect.

FIELD OF THE INVENTION

The present invention relates to a liquid-cooling type thermal module,and more particularly to a thermal module that employs a heat pipe as aheat conducting medium and uses a liquid cooling unit to cool the heatpipe and dissipate heat.

BACKGROUND OF THE INVENTION

While an electronic device operates at constantly increased high speed,electronic elements inside the electronic device also produce a largeamount of heat during the operation thereof. In general, a heat sink ora radiating fin assembly is arranged on the electronic elements toprovide increased heat-dissipating area and thereby enhancedheat-dissipating efficiency. However, the heat sink or the radiating finassembly can only radiates heat and provides very limitedheat-dissipating effect. In order to solve the above problem,liquid-cooling type thermal modules have been developed for providingbetter heat-dissipating effect.

Please refer to FIG. 1, which shows a conventional water-cooling typethermal module 1 including a dissipating unit 11, a pump 14, a firstwater pipe 12, a heat sink 13, and a second water pipe 15. Thedissipating unit 11 has an inner receiving space (not shown), a flow way(not shown), a water outlet (not shown), and a water inlet 111. A fluidis filled in the receiving space. The pump 14 is connected to the wateroutlet of the dissipating unit 11 to pressurize the fluid, so that thefluid flows in the receiving space and the flow way. The heat sink 13has a hollow case with a water inlet 132 and a water outlet 131 providedon a top thereof. The hollow case has a bottom defining a contact face133 for contacting with at least one heat-producing source (not shown)to absorb heat produced by the heat-producing source. The heat sink 13has an internal receiving space (not shown) communicating with the waterinlet 132 and the water outlet 131. The fluid can flow in the receivingspace of the heat sink 13 to circulate between the heat sink 13 and thedissipating unit 11, so that the heat absorbed by the heat sink 13 canbe carried away from the heat sink 13 by the fluid. The first water pipe12 is connected at an end to the pump 14 and at the other end to thewater inlet 132 on the heat sink 13. The second water pipe 15 isconnected at an end to the water inlet 111 on the dissipating unit 11and at the other end to the water outlet 131 on the heat sink 13. Whenthe pump 14 operates, the fluid is driven to flow in and circulatebetween the above components of the thermal module 1 for dissipatingheat. However, since joints between the internal components of theelectronic device are not always watertight, the fluid tends to leak tocause damage to the electronic device. Moreover, the components of theconventional water-cooling type thermal module 1 are complicate tooccupy a large room and can not be easily installed. Therefore, theconventional thermal module 1 requires a relatively high manufacturingcost.

In conclusion, the conventional water-cooling thermal module has thefollowing disadvantages: (1) having complicated components; (2) uneasyto install; (3) being subject to water leak; (4) occupying a relativelylarge room; and (5) requiring relatively high manufacturing cost.

SUMMARY OF THE INVENTION

A primary object of the present invention is to provide a liquid-coolingtype thermal module, which has simple structure and eliminates theproblem of fluid leak.

Another object of the present invention is to provide a liquid-coolingtype thermal module that can be easily assembled.

A further object of the present invention is to provide a liquid-coolingtype thermal module that is able to effectively remove heat produced bya heat-producing element from a system and thereby prevent heat fromaccumulating in the system.

To achieve the above and other objects, the liquid-cooling type thermalmodule according to the present invention includes a liquid cooling unitand at least one heat pipe. The heat pipe has a heat-absorbing end and aheat-dissipating end. The heat-absorbing end is connected to at leastone heat-producing element. The heat-producing element is located insidea system while the liquid cooling unit is located outside the system.The heat pipe connects the heat-producing element to the liquid coolingunit. The heat-dissipating end of the heat pipe is connected to theliquid cooling unit located outside the system. Heat produced by theheat-producing element is absorbed by the heat-absorbing end andtransferred by the heat pipe to the remote heat-dissipating end via theheat-dissipating end and be dissipated. With the heat pipe being used asa medium for conducting heat, the problem of fluid leak can beeliminated, and the heat produced by the heat-producing element can beeffectively carried by the heat pipe away from the system withoutaccumulating therein, enabling the thermal module to provide excellentheat dissipating effect.

With the above arrangements, the liquid-cooling type thermal module ofthe present invention has the following advantages: (1) having simplestructure; (2) eliminating the problem of fluid leak; (3) easy toassemble without occupying too much room; and (4) preventing heat fromaccumulating in the case of an electronic device.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present inventionto achieve the above and other objects can be best understood byreferring to the following detailed description of the preferredembodiments and the accompanying drawings, wherein:

FIG. 1 is an assembled perspective view of a conventional water-coolingtype thermal module;

FIG. 2 is an assembled perspective view of a liquid-cooling type thermalmodule according to a first embodiment of the present invention;

FIG. 3 is a cutaway view of a liquid cooling unit for the liquid-coolingtype thermal module of FIG. 2; and

FIG. 4 is an assembled perspective view of a liquid-cooling type thermalmodule according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 2 and 3. A liquid-cooling type thermal moduleaccording to a first embodiment of the present invention includes aliquid cooling unit 2 and at least one heat pipe 3. The heat pipe 3 hasa heat-absorbing end 31 and a heat-dissipating end 32. Theheat-absorbing end 31 has a flat configuration and is connected to andbearing on at least one heat-producing element 41. The heat-producingelement 41 is located inside a system 4 while the liquid cooling unit 2is located outside the system 4. The heat pipe 3 is extended from theliquid cooling unit 2 into the system 4 with the heat-absorbing end 31bearing on the heat-producing element 41 and the heat-dissipating end 32connected to the liquid cooling unit 2. Heat produced by theheat-producing element 41 is absorbed by the heat pipe 3 at theheat-absorbing end 31 and then transferred via the heat-dissipating end32 to the liquid cooling unit 2, and is finally dissipated into ambientair. Since the heat pipe 3 is able to absorb and exactly transfer heatto the remote liquid cooling unit 2 for dissipation, the heat producedby the heat-producing element 41 would not stagnate around theheat-producing element 41, but can be effectively removed from aninterior of the system 4.

The liquid cooling unit 2 includes a plurality of radiating fins 22protruded from one side of the liquid cooling unit 2. The radiating fins22 are connected to at least one cooling fan 5. The liquid cooling unit2 further includes a pump 21 and internally defines a dissipating space23 and a flow way 24 communicating with the pump 21. A type of fluid isfilled in the dissipating space 23. The pump 21 drives the fluid to flowin the dissipating space 23 and thereby cool the heat-dissipating end 32of the heat pipe 3.

FIG. 4 is an assembled perspective view of a liquid-cooling type thermalmodule according to a second embodiment of the present invention. Pleaserefer to FIGS. 3 and 4. It is noted parts that are the same in the firstand the second embodiment are denoted by the same reference numeralsherein. As in the first embodiment, the liquid-cooling type thermalmodule 2 in the second embodiment is connected to a system 4 fordissipating heat produced by at least one heat-producing element 41located inside the system 4. The liquid-cooling type thermal module 2 ofthe second embodiment includes a liquid cooling unit 2 located outsidethe system 4. The liquid cooling unit 2 is connected to theheat-producing element 41 via at least one heat pipe 3. The liquidcooling unit 2 defines an internal dissipating space 23 and a flow way24, and includes a pump 21 communicable with the flow way 24. A type offluid is filled in the dissipating space 23. The pump 21 drives thefluid to flow in the dissipating space 23.

In the second embodiment, the heat pipe 3 also has a heat-absorbing end31 and a heat-dissipating end 32. The heat-absorbing end 31 is bearingon the heat-producing element 41. When the heat-producing element 41produces heat, the heat-absorbing end 31 of the heat pipe 3 absorbs andtransfers the produced heat to the remote heat-dissipating end 32. Theheat-dissipating end 32 is inserted into the dissipating space 23 of theliquid cooling unit 2, which is located outside the system 4, so thatthe fluid in the dissipating space 23 can cool the heat-dissipating end32 to achieve the purpose of dissipating heat.

In the present invention, by using the heat pipe 3 as a medium forconducting heat, the heat produced by the heat-producing element 41 canbe exactly transferred to an outer side of the system 4 withoutaccumulating therein. Moreover, with the heat pipe 3 being used as themedium of conducting heat, the problem of fluid leak is eliminated anddamage to electronic components inside the system 4 caused by the fluidleak can be prevented.

In the second embodiment, the heat-absorbing end 31 of the heat pipe 3is further connected to at least one heat sink 6. The heat sink 6 isattached to the heat-producing element 41 to give the heat-producingelement 41 an increased heat-dissipating area.

The system 4 can be a case of an electronic device, a telecommunicationcabinet, a computer case, or an LED lamp lens. In the illustratedembodiments of the present invention, the system 4 is a computer case.

The present invention has been described with some preferred embodimentsthereof and it is understood that many changes and modifications in thedescribed embodiments can be carried out without departing from thescope and the spirit of the invention that is intended to be limitedonly by the appended claims.

1. A liquid-cooling type thermal module, comprising a liquid coolingunit and at least one heat pipe; the heat pipe having a heat-absorbingend and a heat-dissipating end, the heat-absorbing end being connectedto at least one heat-producing element, and the heat-dissipating endbeing connected to the liquid cooling unit, whereby heat produced by theheat-producing element is absorbed by the heat-absorbing end andtransferred by the heat pipe to the liquid cooling unit via theheat-dissipating end to be dissipated.
 2. The liquid-cooling typethermal module as claimed in claim 1, wherein the heat-producing elementis located inside a system while the liquid cooling unit is locatedoutside the system, and the heat pipe is extended into the system toconnect the heat-producing element to the liquid cooling unit.
 3. Theliquid-cooling type thermal module as claimed in claim 1, wherein theliquid cooling unit internally defines a dissipating space and includesa pump, a type of fluid being filled in the dissipating space, and thepump driving the fluid to flow in the dissipating space.
 4. Theliquid-cooling type thermal module as claimed in claim 1, wherein atleast one cooling fan is mounted to one side of the liquid cooling unit.5. The liquid-cooling type thermal module as claimed in claim 1, whereinthe heat-absorbing end has a flat configuration for bearing on theheat-producing element.
 6. The liquid-cooling type thermal module asclaimed in claim 1, wherein the heat-absorbing end is connected to atleast one heat sink, and the heat sink is attached to the heat-producingelement.
 7. The liquid-cooling type thermal module as claimed in claim3, wherein the liquid cooling unit further internally defines at leastone flow way in the dissipating space, and the flow way beingcommunicable with the pump.
 8. The liquid-cooling type thermal module asclaimed in claim 3, wherein the heat-dissipating end is inserted intothe dissipating space.
 9. The liquid-cooling type thermal module asclaimed in claim 1, wherein the liquid cooling unit includes a pluralityof radiating fins protruded from one side of the liquid cooling unit.10. The liquid-cooling type thermal module as claimed in claim 2,wherein the liquid cooling unit internally defines a dissipating spaceand includes a pump, a type of fluid being filled in the dissipatingspace, and the pump driving the fluid to flow in the dissipating space.11. The liquid-cooling type thermal module as claimed in claim 2,wherein the system is selected from the group consisting of a case of anelectronic device, a telecommunication cabinet, a computer case, and anLED lamp lens.
 12. The liquid-cooling type thermal module as claimed inclaim 10, wherein the liquid cooling unit further internally defines atleast one flow way in the dissipating space, and the flow way beingcommunicable with the pump.